71V2546S133PFG

Basic Information Overview

Category: Integrated Circuit (IC)
Use: Memory chip
Characteristics: High-speed, low-power, synchronous static random-access memory (SRAM)
Package: Plastic Fine-Pitch Ball Grid Array (FBGA)
Essence: Stores and retrieves digital information in electronic devices
Packaging/Quantity: Typically sold in reels or trays containing multiple units

Specifications

Organization: 256K x 36 bits
Voltage Supply: 3.3V
Access Time: 4.5 ns
Operating Temperature Range: -40°C to +85°C
Data Retention: Greater than 10 years
Pin Count: 119

Detailed Pin Configuration

VDDQ
DQ0
DQ1
DQ2
DQ3
DQ4
DQ5
DQ6
DQ7
DQ8
DQ9
DQ10
DQ11
DQ12
DQ13
DQ14
DQ15
DQ16
DQ17
DQ18
DQ19
DQ20
DQ21
DQ22
DQ23
DQ24
DQ25
DQ26
DQ27
DQ28
DQ29
DQ30
DQ31
GND
VDD
WE#
CAS#
RAS#
CS#
OE#
UB#
LB#
CLK
AD0
AD1
AD2
AD3
AD4
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31
VSSQ
VDDQ
DQS0#
DQS1#
DM0#
DM1#
VREF
VREF
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS

Functional Features

High-speed operation: The 71V2546S133PFG offers fast access times, allowing for quick data retrieval.
Low-power consumption: This memory chip is designed to minimize power usage, making it suitable for battery-powered devices.
Synchronous operation: The chip synchronizes its operations with an external clock signal, ensuring reliable data transfer.
Easy integration: The FBGA package allows for easy integration into electronic devices, providing a compact and reliable memory solution.

Advantages and Disadvantages

Advantages: - High-speed performance - Low-power consumption - Synchronous operation for reliable data transfer - Compact FBGA package for easy integration

Disadvantages: - Limited storage capacity (256K x 36 bits) - Relatively high cost compared to other memory options

Working Principles

The 71V2546S133PFG is a synchronous SRAM that stores digital information in a matrix of memory cells. It operates by utilizing transistors and capacitors to store and retrieve data. The chip synchronizes its

기술 솔루션에 71V2546S133PFG 적용과 관련된 10가지 일반적인 질문과 답변을 나열하세요.

Sure! Here are 10 common questions and answers related to the application of 71V2546S133PFG in technical solutions:

Q: What is the 71V2546S133PFG? A: The 71V2546S133PFG is a specific model of synchronous SRAM (Static Random Access Memory) integrated circuit.
Q: What is the capacity of the 71V2546S133PFG? A: The 71V2546S133PFG has a capacity of 256 kilobits (Kb).
Q: What is the operating voltage range for this IC? A: The operating voltage range for the 71V2546S133PFG is typically between 3.0V and 3.6V.
Q: What is the access time of the 71V2546S133PFG? A: The access time, or the time it takes to read or write data, for the 71V2546S133PFG is typically 13 ns.
Q: Can the 71V2546S133PFG be used in industrial applications? A: Yes, the 71V2546S133PFG is suitable for use in industrial applications due to its wide operating temperature range and robust design.
Q: Does the 71V2546S133PFG support multiple chip enable inputs? A: Yes, the 71V2546S133PFG supports two chip enable inputs, allowing for flexible memory organization.
Q: What is the power consumption of the 71V2546S133PFG? A: The power consumption of the 71V2546S133PFG depends on various factors such as operating frequency and voltage, but it is generally low.
Q: Can the 71V2546S133PFG be used in battery-powered devices? A: Yes, the low power consumption of the 71V2546S133PFG makes it suitable for use in battery-powered devices.
Q: Does the 71V2546S133PFG have any built-in error correction capabilities? A: No, the 71V2546S133PFG does not have built-in error correction capabilities. External error correction techniques may be required if needed.
Q: What are some typical applications for the 71V2546S133PFG? A: The 71V2546S133PFG can be used in various applications such as telecommunications equipment, networking devices, industrial control systems, and automotive electronics.

Please note that these answers are general and may vary depending on specific requirements and datasheet specifications.