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71V3556S133PFG8

71V3556S133PFG8

Basic Information Overview

  • Category: Integrated Circuit (IC)
  • Use: Memory Controller
  • Characteristics: High-speed, Low-power, Versatile
  • Package: Surface Mount Technology (SMT)
  • Essence: Control and manage memory operations
  • Packaging/Quantity: Tape and Reel, 2500 units per reel

Specifications

  • Operating Voltage: 3.3V
  • Operating Temperature Range: -40°C to +85°C
  • Speed: 133 MHz
  • Memory Type Supported: SDRAM, DDR, DDR2, DDR3
  • Pin Count: 208
  • Package Dimensions: 14mm x 20mm

Detailed Pin Configuration

The 71V3556S133PFG8 IC has a total of 208 pins. The pin configuration is as follows:

  1. VDDQ
  2. DQ0
  3. DQ1
  4. DQ2
  5. DQ3
  6. DQ4
  7. DQ5
  8. DQ6
  9. DQ7
  10. DQ8
  11. DQ9
  12. DQ10
  13. DQ11
  14. DQ12
  15. DQ13
  16. DQ14
  17. DQ15
  18. DQ16
  19. DQ17
  20. DQ18
  21. DQ19
  22. DQ20
  23. DQ21
  24. DQ22
  25. DQ23
  26. DQ24
  27. DQ25
  28. DQ26
  29. DQ27
  30. DQ28
  31. DQ29
  32. DQ30
  33. DQ31
  34. A0
  35. A1
  36. A2
  37. A3
  38. A4
  39. A5
  40. A6
  41. A7
  42. A8
  43. A9
  44. A10
  45. A11
  46. A12
  47. A13
  48. A14
  49. A15
  50. A16
  51. A17
  52. A18
  53. A19
  54. A20
  55. A21
  56. A22
  57. A23
  58. A24
  59. A25
  60. A26
  61. A27
  62. A28
  63. A29
  64. A30
  65. A31
  66. BA0
  67. BA1
  68. RAS#
  69. CAS#
  70. WE#
  71. CS#
  72. CKE
  73. CLK
  74. DQM0
  75. DQM1
  76. DQS0
  77. DQS1
  78. DM0
  79. DM1
  80. VSSQ
  81. VDDQ
  82. VREFCA
  83. VREFDQ
  84. VSSDQ
  85. VDDQ
  86. VSSDQ
  87. VDDQ
  88. VSSDQ
  89. VDDQ
  90. VSSDQ
  91. VDDQ
  92. VSSDQ
  93. VDDQ
  94. VSSDQ
  95. VDDQ
  96. VSSDQ
  97. VDDQ
  98. VSSDQ
  99. VDDQ
  100. VSSDQ
  101. VDDQ
  102. VSSDQ
  103. VDDQ
  104. VSSDQ
  105. VDDQ
  106. VSSDQ
  107. VDDQ
  108. VSSDQ
  109. VDDQ
  110. VSSDQ
  111. VDDQ
  112. VSSDQ
  113. VDDQ
  114. VSSDQ
  115. VDDQ
  116. VSSDQ
  117. VDDQ
  118. VSSDQ
  119. VDDQ
  120. VSSDQ
  121. VDDQ
  122. VSSDQ
  123. VDDQ
  124. VSSDQ
  125. VDDQ
  126. VSSDQ
  127. VDDQ
  128. VSSDQ
  129. VDDQ
  130. VSSDQ
  131. VDDQ
  132. VSSDQ
  133. VDDQ
  134. VSSDQ
  135. VDDQ
  136. VSSDQ
  137. VDDQ
  138. VSSDQ
  139. VDDQ
  140. VSS

기술 솔루션에 71V3556S133PFG8 적용과 관련된 10가지 일반적인 질문과 답변을 나열하세요.

Sure! Here are 10 common questions and answers related to the application of 71V3556S133PFG8 in technical solutions:

  1. Q: What is the 71V3556S133PFG8? A: The 71V3556S133PFG8 is a specific model of synchronous dynamic random-access memory (SDRAM) chip.

  2. Q: What is the capacity of the 71V3556S133PFG8? A: The 71V3556S133PFG8 has a capacity of 256 megabits (Mb).

  3. Q: What is the operating voltage range for this chip? A: The operating voltage range for the 71V3556S133PFG8 is typically 2.5V to 3.3V.

  4. Q: What is the maximum clock frequency supported by this chip? A: The 71V3556S133PFG8 supports a maximum clock frequency of 133 MHz.

  5. Q: What is the data transfer rate of the 71V3556S133PFG8? A: The data transfer rate of this chip is 266 megabits per second (Mbps).

  6. Q: Can the 71V3556S133PFG8 be used in industrial applications? A: Yes, the 71V3556S133PFG8 is suitable for use in industrial applications due to its robust design and temperature range.

  7. Q: Does this chip support ECC (Error Correction Code)? A: No, the 71V3556S133PFG8 does not support ECC. It is a non-ECC memory chip.

  8. Q: What is the package type for the 71V3556S133PFG8? A: The 71V3556S133PFG8 comes in a 54-pin TSOP (Thin Small Outline Package) form factor.

  9. Q: Can this chip be used in both single and dual-rank configurations? A: Yes, the 71V3556S133PFG8 can be used in both single and dual-rank configurations, providing flexibility in system design.

  10. Q: Is there any special consideration for power supply decoupling with this chip? A: Yes, it is recommended to follow the manufacturer's guidelines for power supply decoupling to ensure stable operation of the 71V3556S133PFG8.

Please note that these answers are based on general information about the 71V3556S133PFG8 and may vary depending on specific application requirements.