IDT71V65802S133BG
Product Overview
- Category: Integrated Circuit (IC)
- Use: Memory device
- Characteristics: High-speed, low-power, synchronous static random-access memory (SRAM)
- Package: Ball Grid Array (BGA)
- Essence: Provides high-performance data storage and retrieval capabilities for various electronic devices
- Packaging/Quantity: Available in tape and reel packaging, quantity varies based on customer requirements
Specifications
- Memory Type: Synchronous SRAM
- Density: 8 Megabits (1 Megabyte)
- Organization: 512K words x 16 bits
- Operating Voltage: 3.3V
- Access Time: 133 MHz
- Interface: Parallel
- Operating Temperature Range: -40°C to +85°C
- Data Retention: Greater than 10 years
Pin Configuration
The IDT71V65802S133BG has a total of 119 pins. The detailed pin configuration is as follows:
- VDDQ
- DQ0
- DQ1
- DQ2
- DQ3
- DQ4
- DQ5
- DQ6
- DQ7
- VSSQ
- DQ8
- DQ9
- DQ10
- DQ11
- DQ12
- DQ13
- DQ14
- DQ15
- VDDQ
- DQ16
- DQ17
- DQ18
- DQ19
- DQ20
- DQ21
- DQ22
- DQ23
- VSSQ
- DQ24
- DQ25
- DQ26
- DQ27
- DQ28
- DQ29
- DQ30
- DQ31
- VDDQ
- A0
- A1
- A2
- A3
- A4
- A5
- A6
- A7
- A8
- A9
- A10
- A11
- A12
- A13
- A14
- A15
- A16
- A17
- A18
- A19
- A20
- A21
- A22
- A23
- A24
- A25
- A26
- A27
- A28
- A29
- A30
- A31
- A32
- A33
- A34
- A35
- A36
- A37
- A38
- A39
- A40
- A41
- A42
- A43
- A44
- A45
- A46
- A47
- A48
- A49
- A50
- A51
- A52
- A53
- A54
- A55
- A56
- A57
- A58
- A59
- A60
- A61
- A62
- A63
- A64
- A65
- A66
- A67
- A68
- A69
- A70
- A71
- A72
- A73
- A74
- A75
- A76
- A77
- A78
- A79
- VDDQ
- VSSQ
Functional Features
- High-speed operation with a 133 MHz access time
- Low-power consumption for energy-efficient applications
- Synchronous interface for easy integration into various systems
- Reliable data retention for long-term storage requirements
- Wide operating temperature range for versatile usage scenarios
Advantages and Disadvantages
Advantages
- High-performance memory solution suitable for demanding applications
- Low power consumption helps extend battery life in portable devices
- Synchronous interface allows for efficient data transfer
- Reliable data retention ensures data integrity over extended periods
- Wide operating temperature range enables usage in various environments
Disadvantages
- Limited density compared to other memory technologies
- Higher cost per bit compared to
기술 솔루션에 IDT71V65802S133BG 적용과 관련된 10가지 일반적인 질문과 답변을 나열하세요.
Sure! Here are 10 common questions and answers related to the application of IDT71V65802S133BG in technical solutions:
Q: What is IDT71V65802S133BG? A: IDT71V65802S133BG is a specific model of synchronous static random-access memory (SRAM) chip manufactured by Integrated Device Technology (IDT).
Q: What is the capacity of IDT71V65802S133BG? A: The IDT71V65802S133BG has a capacity of 8 Megabits (Mb), which is equivalent to 1 Megabyte (MB).
Q: What is the operating voltage range for IDT71V65802S133BG? A: The operating voltage range for IDT71V65802S133BG is typically between 3.0V and 3.6V.
Q: What is the access time of IDT71V65802S133BG? A: The access time of IDT71V65802S133BG is 133 nanoseconds (ns).
Q: Can IDT71V65802S133BG be used in industrial applications? A: Yes, IDT71V65802S133BG is suitable for use in industrial applications due to its robustness and reliability.
Q: Does IDT71V65802S133BG support burst mode operation? A: No, IDT71V65802S133BG does not support burst mode operation. It is a synchronous SRAM that operates on a single read or write cycle at a time.
Q: What is the pin configuration of IDT71V65802S133BG? A: IDT71V65802S133BG has a 44-pin TSOP (Thin Small Outline Package) configuration.
Q: Can IDT71V65802S133BG be used in battery-powered devices? A: Yes, IDT71V65802S133BG can be used in battery-powered devices as it operates within the typical voltage range of such devices.
Q: Is IDT71V65802S133BG compatible with other SRAM chips? A: Yes, IDT71V65802S133BG is compatible with other SRAM chips that have similar specifications and pin configurations.
Q: What are some common applications of IDT71V65802S133BG? A: IDT71V65802S133BG is commonly used in networking equipment, telecommunications systems, embedded systems, and other high-performance computing applications where fast and reliable memory access is required.
Please note that the answers provided here are general and may vary depending on specific requirements and use cases.