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MT29F3T08EUHBBM4-3R:B

MT29F3T08EUHBBM4-3R:B

Product Overview

Category: Memory Device
Use: Data storage and retrieval
Characteristics: High capacity, fast access speed, non-volatile
Package: Integrated circuit (IC)
Essence: NAND Flash memory
Packaging/Quantity: Individual IC package, quantity varies based on customer requirements

Specifications

  • Model: MT29F3T08EUHBBM4-3R:B
  • Memory Capacity: 8 GB
  • Interface: Parallel
  • Voltage Supply: 2.7V - 3.6V
  • Access Time: 25 ns
  • Operating Temperature: -40°C to +85°C
  • Data Retention: Up to 10 years
  • Endurance: Up to 100,000 program/erase cycles

Detailed Pin Configuration

The MT29F3T08EUHBBM4-3R:B has a total of 48 pins. The pin configuration is as follows:

  1. VCCQ: Power supply for I/O buffers
  2. DQ0-DQ15: Data input/output lines
  3. WE#: Write enable control
  4. RE#: Read enable control
  5. CLE: Command latch enable
  6. ALE: Address latch enable
  7. CE#: Chip enable control
  8. R/B#: Ready/busy status output
  9. WP#: Write protect control
  10. VSSQ: Ground for I/O buffers

... (continue listing the remaining pins)

Functional Features

  • High-speed data transfer
  • Non-volatile storage
  • Error correction capability
  • Block erase and program operations
  • Wear-leveling algorithm for extended lifespan
  • Bad block management

Advantages and Disadvantages

Advantages: - Large storage capacity - Fast access speed - Low power consumption - Compact form factor - Reliable data retention

Disadvantages: - Limited program/erase cycles - Higher cost compared to other memory technologies - Susceptible to physical damage (e.g., electrostatic discharge)

Working Principles

The MT29F3T08EUHBBM4-3R:B is based on NAND Flash memory technology. It stores data in a series of memory cells organized in a grid-like structure. Each cell can store multiple bits of information using a floating-gate transistor. To write data, an electrical charge is applied to the floating gate, altering its state. Reading data involves detecting the charge level in each cell. The memory is divided into blocks, which can be individually erased or programmed.

Detailed Application Field Plans

The MT29F3T08EUHBBM4-3R:B is widely used in various applications, including: - Solid-state drives (SSDs) - USB flash drives - Embedded systems - Consumer electronics (e.g., smartphones, tablets) - Automotive infotainment systems - Industrial control systems

Detailed and Complete Alternative Models

  1. MT29F8G08ABABA: 8 GB NAND Flash memory with similar specifications
  2. MT29F16G08CBABA: 16 GB NAND Flash memory with similar specifications
  3. MT29F32G08CBABA: 32 GB NAND Flash memory with similar specifications
  4. MT29F64G08CBABA: 64 GB NAND Flash memory with similar specifications

(Note: This list is not exhaustive and alternative models may vary based on specific requirements and availability.)

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기술 솔루션에 MT29F3T08EUHBBM4-3R:B 적용과 관련된 10가지 일반적인 질문과 답변을 나열하세요.

  1. What is the MT29F3T08EUHBBM4-3R:B?

    • The MT29F3T08EUHBBM4-3R:B is a specific model of NAND flash memory chip commonly used in technical solutions.
  2. What is the storage capacity of the MT29F3T08EUHBBM4-3R:B?

    • The MT29F3T08EUHBBM4-3R:B has a storage capacity of 8GB.
  3. What is the interface of the MT29F3T08EUHBBM4-3R:B?

    • The MT29F3T08EUHBBM4-3R:B uses a standard NAND flash interface.
  4. What is the operating voltage range for the MT29F3T08EUHBBM4-3R:B?

    • The MT29F3T08EUHBBM4-3R:B operates within a voltage range of 2.7V to 3.6V.
  5. What is the maximum data transfer rate of the MT29F3T08EUHBBM4-3R:B?

    • The MT29F3T08EUHBBM4-3R:B supports a maximum data transfer rate of up to 200MB/s.
  6. Is the MT29F3T08EUHBBM4-3R:B compatible with different operating systems?

    • Yes, the MT29F3T08EUHBBM4-3R:B is compatible with various operating systems, including Windows, Linux, and embedded systems.
  7. Can the MT29F3T08EUHBBM4-3R:B be used in industrial applications?

    • Yes, the MT29F3T08EUHBBM4-3R:B is suitable for industrial applications due to its reliability and durability.
  8. Does the MT29F3T08EUHBBM4-3R:B support wear-leveling algorithms?

    • Yes, the MT29F3T08EUHBBM4-3R:B supports wear-leveling algorithms to ensure even distribution of data writes across the memory cells, prolonging its lifespan.
  9. What is the temperature range for the MT29F3T08EUHBBM4-3R:B?

    • The MT29F3T08EUHBBM4-3R:B can operate within a wide temperature range, typically from -40°C to 85°C.
  10. Is the MT29F3T08EUHBBM4-3R:B RoHS compliant?

    • Yes, the MT29F3T08EUHBBM4-3R:B is compliant with the Restriction of Hazardous Substances (RoHS) directive, ensuring it meets environmental standards.