LPC1785FBD208,551

Product Overview

• Category: Microcontroller
• Use: Embedded systems and applications
• Characteristics:
  • High-performance ARM Cortex-M3 core
  • Clock frequency up to 120 MHz
  • Flash memory of 512 KB
  • RAM of 96 KB
  • Package: BGA (Ball Grid Array)
  • Essence: Advanced microcontroller for various embedded applications
  • Packaging/Quantity: Tape and Reel, 551 units per reel

Specifications

• Core: ARM Cortex-M3
• Clock Frequency: Up to 120 MHz
• Flash Memory: 512 KB
• RAM: 96 KB
• Package Type: BGA (Ball Grid Array)
• Package Dimensions: 17 mm x 17 mm
• Operating Voltage: 2.4 V to 3.6 V
• I/O Pins: 208
• Communication Interfaces: UART, SPI, I2C, USB, Ethernet
• Analog Inputs: 8 channels
• ADC Resolution: 12-bit
• PWM Channels: 6
• Timers: 4
• Operating Temperature Range: -40°C to +85°C

Detailed Pin Configuration

The LPC1785FBD208,551 microcontroller has a total of 208 I/O pins. The pin configuration is as follows:

• Pins 1-10: Power supply and ground pins
• Pins 11-20: Analog input pins
• Pins 21-30: Digital I/O pins
• Pins 31-40: Communication interface pins
• Pins 41-50: Timer and PWM pins
• Pins 51-60: Other peripheral pins
• Pins 61-70: Reserved for future use
• Pins 71-80: JTAG interface pins
• Pins 81-90: Debug interface pins
• Pins 91-100: External interrupt pins
• Pins 101-110: Clock and reset pins
• Pins 111-120: Memory interface pins
• Pins 121-130: Ethernet interface pins
• Pins 131-140: USB interface pins
• Pins 141-150: I2C interface pins
• Pins 151-160: SPI interface pins
• Pins 161-170: CAN interface pins
• Pins 171-180: SD/MMC interface pins
• Pins 181-190: LCD interface pins
• Pins 191-200: ADC reference voltage pins
• Pins 201-208: Reserved for future use

Functional Features

The LPC1785FBD208,551 microcontroller offers the following functional features:

1. High-performance ARM Cortex-M3 core for efficient processing.
2. Clock frequency of up to 120 MHz for fast execution.
3. Ample flash memory of 512 KB for program storage.
4. Sufficient RAM of 96 KB for data storage.
5. Multiple communication interfaces (UART, SPI, I2C, USB, Ethernet) for connectivity.
6. Analog inputs with 12-bit ADC resolution for accurate analog measurements.
7. PWM channels for generating precise analog signals.
8. Timers for timekeeping and event scheduling.

Advantages and Disadvantages

Advantages: - High-performance ARM Cortex-M3 core enables efficient processing. - Ample flash memory and RAM provide sufficient storage capacity. - Multiple communication interfaces allow for versatile connectivity options. - Analog inputs with high-resolution ADC enable accurate analog measurements. - PWM channels and timers enhance the microcontroller's functionality.

Disadvantages: - Limited number of I/O pins may restrict the complexity of projects. - BGA package may require specialized equipment for soldering and rework. - Higher power consumption compared to low-power microcontrollers.

Working Principles

The LPC1785FBD208,551 microcontroller operates based on the ARM Cortex-M3 architecture. It executes instructions stored in its flash memory and utilizes its peripherals to interact with external devices. The clock frequency determines the speed at which instructions are processed. The microcontroller's I/O pins allow for communication with other devices, while the analog inputs and ADC enable accurate measurement of analog signals. The PWM channels and timers facilitate the generation of precise analog signals and timekeeping functions, respectively.

Detailed Application Field Plans

The LPC1785FBD208,551 microcontroller finds applications in various fields, including:

1. Industrial Automation: Control systems, motor control, and data acquisition.
2. Internet of Things (IoT): Smart home automation, sensor networks, and remote monitoring.
3. Automotive: Engine management, dashboard displays, and vehicle diagnostics.
4. Consumer Electronics: Home appliances, gaming consoles, and audio/video equipment.
5. Medical Devices: Patient monitoring, diagnostic equipment, and medical imaging.
6. Robotics: Robot control, motion planning, and sensor integration.
7. Energy Management: Smart grid systems