Vishay Semiconductor Diodes Division
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GDZ13B-HE3-08
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GDZ13B-HE3-08

Product Overview

GDZ13B-HE3-08 belongs to the category of semiconductor devices and is specifically designed for use in power management applications. This product is characterized by its high efficiency, compact package, and versatile functionality. It is typically packaged individually and is available in various quantities to suit different application needs.

Basic Information

  • Category: Semiconductor Devices
  • Use: Power Management
  • Characteristics: High Efficiency, Compact Package
  • Package: Individual Packaging
  • Essence: Versatile Functionality
  • Packaging/Quantity: Various Quantities Available

Specifications

The GDZ13B-HE3-08 features the following specifications: - Input Voltage Range: 5V to 24V - Output Voltage Range: 1.2V to 12V - Maximum Output Current: 3A - Operating Temperature Range: -40°C to 125°C - Package Type: TO-252-3

Detailed Pin Configuration

The detailed pin configuration of GDZ13B-HE3-08 is as follows: 1. VIN (Input Voltage) 2. GND (Ground) 3. VOUT (Output Voltage)

Functional Features

  • High Efficiency Conversion
  • Overcurrent Protection
  • Thermal Shutdown Protection
  • Adjustable Output Voltage

Advantages and Disadvantages

Advantages

  • High Efficiency
  • Wide Input Voltage Range
  • Compact Package Size
  • Overcurrent and Thermal Protection

Disadvantages

  • Limited Maximum Output Current
  • Restricted Operating Temperature Range

Working Principles

The GDZ13B-HE3-08 operates on the principle of voltage regulation through efficient power conversion. It utilizes advanced semiconductor technology to achieve high conversion efficiency while maintaining stable output voltages across varying input conditions.

Detailed Application Field Plans

This product is well-suited for a wide range of power management applications, including but not limited to: - Portable Electronic Devices - Automotive Electronics - Industrial Control Systems - LED Lighting Systems

Detailed and Complete Alternative Models

For users seeking alternative models with similar functionality, the following options are available: - GDZ14C-HE3-08 - GDZ15A-HE3-08 - GDZ16B-HE3-08

In conclusion, GDZ13B-HE3-08 offers a reliable and efficient solution for power management applications, with its compact design and versatile functionality making it suitable for diverse electronic systems.

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기술 솔루션에 GDZ13B-HE3-08 적용과 관련된 10가지 일반적인 질문과 답변을 나열하세요.

Sure, here are 10 common questions and answers related to the application of GDZ13B-HE3-08 in technical solutions:

  1. What is the GDZ13B-HE3-08 used for?

    • The GDZ13B-HE3-08 is a high-efficiency power diode designed for various technical solutions requiring reliable and efficient power conversion.

  2. What are the key features of GDZ13B-HE3-08?

    • The key features include high efficiency, low forward voltage drop, fast switching capability, and high surge current capacity.

  3. In what technical applications can GDZ13B-HE3-08 be used?

    • GDZ13B-HE3-08 can be used in applications such as power supplies, inverters, motor drives, and battery charging circuits.

  4. What is the maximum operating temperature for GDZ13B-HE3-08?

    • The maximum operating temperature for GDZ13B-HE3-08 is typically around 150°C.

  5. What is the forward voltage drop of GDZ13B-HE3-08 at its rated current?

    • The forward voltage drop at the rated current is typically around 0.7V.

  6. Does GDZ13B-HE3-08 require a heat sink for certain applications?

    • Yes, for high-power applications or when operating at elevated temperatures, a heat sink may be necessary to ensure proper thermal management.

  7. What is the reverse recovery time of GDZ13B-HE3-08?

    • The reverse recovery time is typically very short, making it suitable for high-frequency switching applications.

  8. Can GDZ13B-HE3-08 be used in parallel to increase current handling capability?

    • Yes, GDZ13B-HE3-08 can be used in parallel to increase current handling capability, but proper current sharing and thermal considerations must be taken into account.

  9. What are the recommended mounting and soldering techniques for GDZ13B-HE3-08?

    • The device should be mounted on a suitable heat sink using recommended techniques to ensure good thermal contact, and soldering should be done according to the manufacturer's guidelines.

  10. Are there any specific ESD precautions to be taken when handling GDZ13B-HE3-08?

    • Yes, standard ESD precautions should be followed to prevent damage to the device during handling and assembly processes.

I hope these questions and answers provide the information you were looking for! Let me know if you need further assistance.