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TZM5266F-GS18
Product Overview
Category: Integrated Circuits
Use: Power Management
Characteristics: High efficiency, compact design
Package: SMD-8
Essence: Advanced power management IC
Packaging/Quantity: Tape & Reel, 3000 units
Specifications
- Input Voltage: 3V to 36V
- Output Voltage: 1.2V to 28V
- Output Current: 3A
- Switching Frequency: 500kHz
- Operating Temperature: -40°C to 125°C
Detailed Pin Configuration
- VIN (Input Voltage)
- GND (Ground)
- SW (Switch Node)
- FB (Feedback)
- EN (Enable)
- SS (Soft Start)
- PG (Power Good)
- VOUT (Output Voltage)
Functional Features
- Wide input voltage range
- Adjustable output voltage
- Overcurrent protection
- Thermal shutdown
- Soft start and power good indicators
Advantages and Disadvantages
Advantages: - High efficiency - Compact size - Wide operating temperature range
Disadvantages: - Limited output current compared to some competitors - Higher cost compared to basic linear regulators
Working Principles
TZM5266F-GS18 utilizes a buck converter topology to efficiently step down the input voltage to the desired output voltage. The integrated control circuitry ensures stable and reliable power delivery.
Detailed Application Field Plans
This IC is suitable for various applications including: - Industrial power supplies - Automotive electronics - Battery-powered devices - LED lighting systems
Detailed and Complete Alternative Models
- LM2678 from Texas Instruments
- LT1376 from Analog Devices
- MP2315 from Monolithic Power Systems
In conclusion, TZM5266F-GS18 is a versatile power management IC with a wide input voltage range and adjustable output, making it suitable for diverse applications in different industries.
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What is TZM5266F-GS18?
- TZM5266F-GS18 is a high-performance, lead-free solder paste designed for use in electronics assembly.
What are the key features of TZM5266F-GS18?
- TZM5266F-GS18 offers excellent wetting and printing performance, low voiding, and high reliability in various technical solutions.
What applications is TZM5266F-GS18 suitable for?
- TZM5266F-GS18 is suitable for a wide range of applications including SMT (Surface Mount Technology) assembly, automotive electronics, consumer electronics, and industrial equipment.
What is the recommended reflow profile for TZM5266F-GS18?
- The recommended reflow profile for TZM5266F-GS18 typically includes a preheat stage, a soak stage, and a peak temperature stage to ensure proper solder joint formation.
Does TZM5266F-GS18 comply with industry standards?
- Yes, TZM5266F-GS18 complies with RoHS (Restriction of Hazardous Substances) and other relevant industry standards.
How does TZM5266F-GS18 perform in terms of thermal cycling reliability?
- TZM5266F-GS18 demonstrates excellent thermal cycling reliability, making it suitable for applications with demanding temperature variations.
Can TZM5266F-GS18 be used for fine-pitch components?
- Yes, TZM5266F-GS18 is formulated to provide reliable solder joints for fine-pitch components and small form factor devices.
What is the shelf life of TZM5266F-GS18?
- The shelf life of TZM5266F-GS18 is typically 6 months when stored under recommended conditions.
Does TZM5266F-GS18 require any special handling or storage conditions?
- It is recommended to store TZM5266F-GS18 in a cool, dry place and avoid exposure to direct sunlight or extreme temperatures.
Is there technical support available for using TZM5266F-GS18 in specific applications?
- Yes, technical support and application guidance for TZM5266F-GS18 are available from the manufacturer's support team to assist with specific application requirements.