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TZM5267F-GS18
Introduction
TZM5267F-GS18 is a high-performance integrated circuit belonging to the category of power management ICs. This versatile component offers a wide range of applications and features, making it an essential part of various electronic devices.
Basic Information Overview
- Category: Power Management IC
- Use: Regulating and controlling power supply in electronic devices
- Characteristics: High efficiency, compact design, versatile applications
- Package: Small outline package (SOP), 16-pin
- Essence: Efficient power management and regulation
- Packaging/Quantity: Typically packaged in reels of 2500 units
Specifications
- Input Voltage Range: 4.5V to 28V
- Output Voltage Range: 0.8V to 24V
- Output Current: Up to 3A
- Switching Frequency: Adjustable up to 2MHz
- Operating Temperature Range: -40°C to 125°C
- Protection Features: Overcurrent protection, thermal shutdown, input undervoltage lockout
Detailed Pin Configuration
- VIN: Input voltage
- SW: Switch node
- PGND: Power ground
- AGND: Analog ground
- FB: Feedback pin
- EN: Enable pin
- SS/TR: Soft-start/tracking pin
- COMP: Compensation pin
- VOUT: Output voltage
- BST: Bootstrap capacitor connection
- SS/TR: Soft-start/tracking pin
- RT/CLK: Oscillator resistor/clock synchronization
- SYNC: Synchronization input
- PGOOD: Power good indicator
- SS/TR: Soft-start/tracking pin
- PGND: Power ground
Functional Features
- High Efficiency: Provides efficient power conversion, reducing energy loss
- Wide Input Voltage Range: Suitable for various power sources
- Adjustable Switching Frequency: Allows optimization for different applications
- Comprehensive Protection: Built-in safeguards for reliable operation
Advantages and Disadvantages
Advantages
- Versatile applications in various electronic devices
- Compact design for space-constrained applications
- High efficiency for reduced power consumption
Disadvantages
- Higher cost compared to standard power management ICs
- Complex pin configuration may require careful PCB layout
Working Principles
TZM5267F-GS18 operates by regulating the input voltage and converting it to the desired output voltage with minimal energy loss. The integrated control circuitry ensures stable and efficient power delivery while providing protection against overcurrent and thermal issues.
Detailed Application Field Plans
- Consumer Electronics: Power supply regulation in smartphones, tablets, and portable devices
- Industrial Equipment: Control and regulation of power systems in industrial machinery
- Automotive Electronics: Integration into automotive power management systems for efficient energy utilization
Detailed and Complete Alternative Models
- TZM5267E-GS18: Similar specifications with enhanced thermal performance
- TZM5267D-GS18: Lower cost variant with slightly reduced output current capability
- TZM5267H-GS18: Higher output voltage range for specific applications
In conclusion, TZM5267F-GS18 is a highly versatile and efficient power management IC with a wide range of applications across different industries. Its advanced features and comprehensive protection make it an ideal choice for demanding electronic systems.
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What is TZM5267F-GS18?
- TZM5267F-GS18 is a high-performance molybdenum alloy with added titanium and zirconium, known for its excellent high-temperature strength and creep resistance.
What are the key properties of TZM5267F-GS18?
- TZM5267F-GS18 exhibits high melting point, good thermal conductivity, low coefficient of thermal expansion, and excellent mechanical properties at elevated temperatures.
In what technical solutions can TZM5267F-GS18 be used?
- TZM5267F-GS18 is commonly used in aerospace, defense, and high-temperature industrial applications such as furnace components, rocket nozzles, and die inserts for casting aluminum and other non-ferrous alloys.
How does TZM5267F-GS18 compare to other molybdenum alloys?
- TZM5267F-GS18 offers improved high-temperature strength and creep resistance compared to pure molybdenum and other molybdenum alloys.
What are the machining considerations for TZM5267F-GS18?
- TZM5267F-GS18 is best machined using methods suitable for hard materials, such as grinding or electrical discharge machining (EDM).
Can TZM5267F-GS18 be welded?
- Yes, TZM5267F-GS18 can be welded using processes such as TIG (tungsten inert gas) welding or electron beam welding.
Does TZM5267F-GS18 require any special handling or storage conditions?
- TZM5267F-GS18 should be handled with care to avoid damage to its surface, and it should be stored in a dry environment to prevent oxidation.
What are the temperature limits for TZM5267F-GS18 in continuous service?
- TZM5267F-GS18 can be used in continuous service at temperatures up to 2000°C (3632°F).
Are there any specific design considerations when using TZM5267F-GS18 in technical solutions?
- Designers should consider the material's high-temperature properties, thermal expansion characteristics, and potential for oxidation when incorporating TZM5267F-GS18 into their designs.
Where can TZM5267F-GS18 be sourced from?
- TZM5267F-GS18 can be sourced from specialized metal suppliers and manufacturers who produce molybdenum-based alloys for technical applications.